BOARD TO BOARD SOLUTIONS
SEAM/SEAF(High Density Array) SAMTEC SEARAY
ZA8/ZA1 (Low Profile Array) SAMTEC ZRAY 56Gbps
QTH/QSH(High Speed Connector) SAMTEC QSTRIP QRATE
ERM5/ERF8 (EDGE RATE) SAMTEC Mezzanine Strips ADM6/ADF6
LSHM/BTH/BSH/EDM6(ULTRA MICRO INTERCONNECTS) SAMTEC Razor Beam™
FTSH/CLP/FW/FTR/HMTSW/DW/SSQ/SSW/ ZLTMM (SKYSCRAPER FLRXIBLE STACKING) SFM/FOLC/SFMC SAMTEC MICRO (0.5,0.635,0.8,1.27mm PITCH) 2.2,2.6,3.2,3.8 AMP...
JSOM PRECISION BOARD STANOFF
SEAM/SEAF(High Density Array) SAMTEC SEARAY
Specifications
- Performance up to 18 GHz/pair
- Up to 500 I/Os in open pin field design
- 1.27 mm (.050″) pitch and space saving 0.80 mm pitch
- Can be “zippered” during mating/unmating
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 – 17 mm stack heights
- Vertical, right angle, press fit
- 85Ω systems
- VITA 47, VITA 57, Pismo 2 certified
- IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
- IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
ZA8/ZA1 (Low Profile Array) SAMTEC ZRAY 56Gbps
Specifications
- Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
- Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
- Low 30 g normal force with .008″ contact deflection
- 500 mA per line
- Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
QTH/QSH(High Speed Connector) SAMTEC QSTRIP QRATE
Specifications
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5.00 mm – 25.00 mm
ERM5/ERF8 (EDGE RATE) SAMTEC Mezzanine Strips ADM6/ADF6
Specifications
- Edge Rate® contacts optimized for signal integrity performance
- Robust when “zippered” during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
LSHM/BTH/BSH/EDM6(ULTRA MICRO INTERCONNECTS) SAMTEC Razor Beam™
Specifications
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts
FTSH/CLP/FW/FTR/HMTSW/DW/SSQ/ SSW/ZLTMM (SKYSCRAPER FLRXIBLE STACKING) SFM/FOLC/SFMC SAMTEC MICRO (0.5,0.635,0.8,1.27mm PITCH) 2.2,2.6,3.2,3.8 AMP…
Specifications
- .100″ PITCH SQUARE POST SOCKETS AND TERMINALS
- 2.00 MM PITCH SOCKETS AND TERMINALS
- PC/104-PLUS™ SQUARE POST SYSTEMS
- SCREW MACHINE STRIPS
- SHUNTS AND JUMPERS
- 050″ Systems
- Micro Rugged Board-to-Board
- Micro Pitch Systems
- Compression / One-Piece
- .050″ x .100″
ZA8/ZA1 (Low Profile Array) SAMTEC ZRAY 56Gbps
Specifications
- Works as a traditional standoff
- Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
- Reduces risk for component damage on boards
- Board stacks from 4.00 mm to 16.00 mm
- Press-fit and threaded bases available
- Four Row High-Density